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Diode Passivation Powder
This series of glass is an amorphous powder whose main components are lead oxide, silicon dioxide, and aluminum oxide.
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- Product Description
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I. Scope of Application
BYBP840 is part of a product series; the glass powder is suitable for passivation encapsulation in semiconductors.
2. Properties and Composition of Glass:
This series of glass is an amorphous powder whose main components are lead oxide, silicon dioxide, and aluminum oxide.
III. Quality Control and Key Inspection Items
Model
Constituent components
Transition temperature ±5℃
Softening temperature ±5℃
Melting temperature ±5℃
Coefficient of thermal expansion ×10⁻⁷/℃
Granularity D50um
BYBP840
Pb-Si-Al 620
740
840
40-50
3.5
4. Appearance, Packaging, and Storage
1. Appearance: Off-white powder.
2. Packaging: The inner packaging is in plastic bags; the outer packaging is either kraft paper bags or plastic drums, with each package (drum) containing 10–20 kilograms. The outer packaging shall clearly indicate the manufacturer’s name, product name, specifications and model, weight, and batch number.
3. Storage and Quality Assurance: Store at a temperature between 5°C and 30°C and relative humidity below 70%. The shelf life is three years from the date of manufacture.
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Address: Building B1-5-4, Guiyang High-tech SME Incubation Park, Shawen Town, Baiyun District, Guiyang City, Guizhou Province
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